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Wire bonder TPT HB 16

Name:	Wire bonder TPT HB 16
Instrument:	TPT HB 16
Technology / Methodology:	Packaging & Testing
Location:	CEITEC Vysoké učení technické v Brně
Instrument description:	Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding. The welding process is realized by wire attached to the substrate by bonding tool at the end of ultrasonic transducer, which is getting closer to certain distance to the sample surface. To achieve enhanced welding capability, sample is heated up to a certain temperature, for most processes being in the range from 20 °C to 250 °C. Attachment techniques defined by bonder tools are performed by wedge-wedge, ball-wedge, ribbon and bump bonding class.
More information / Supplier:	http://cfnano.ceitec.cz/instrument.php?id=8
Research group:	CF: CEITEC Nano
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