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Magnetron sputtering system BESTEC

Name:	Magnetron sputtering system BESTEC
Technology / Methodology:	Etching & Deposition
Materials:	Au - 1nm, Pt - 1nm
Location:	CEITEC Vysoké učení technické v Brně
Instrument description:	The system consists of a sputter deposition chamber with 8 magnetrons in sputter up configuration. The lid flange of the sputtering chamber is sealed with double viton o- rings and differentially pumped. For the chamber we use turbomolecular pumps with scroll foreline pump. For good end pressure a Ti- sublimation pump is also included. With the pumping configuration it is possible to reach the base pressure of 3x 10-9 mbar with bake out of the clean chamber. The gas inlet in the process chambers is realized with mass flow controllers. For sputter gas Ar we use a 50sccm range device and for O2 and N2 a 10sccm device is used. Pressure regulation is done by up stream process using a three stage valve over the turbo pump. The substrates max. 4” in diameter or several smaller substráte pieces can be mounted on different sample holders from molybdenum (totally 2 in the scope of supply). There is a manually sample transfer foreseen into and out of the process chamber. In the process chamber the sample can be heated to 850°C with radiation heating. The sample stage is thermal shielded and water cooled to prevent from heating up. The substrate can rotate motorized with max. 30 rpm.
Research group:	CF: CEITEC Nano

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