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Ion-Beam Sputter Deposition System BESTEC

Name:	Ion-Beam Sputter Deposition System BESTEC
Location:	CEITEC Vysoké učení technické v Brně
Instrument description:	UHV sputter deposition system is equipped with two RFICP Kaufman ion-beam sources (KRI®) with 4 cm diameter grids (3-grid primary and 2-grid assisted/secondary) and charge neutralizer (LFN 2000 - KRI®). This setup is suitable for Ion-beam sputter deposition, Ion-beam assisted deposition, reactive sputter deposition with nitrogen and in-situ initial/continual substrate (pre-)cleaning. Etching (ion-milling) is not possible due to undesirable chamber and targets contamination.
Research group:	CF: CEITEC Nano

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