Topics of interest:
- Microelectronics assembly
- Packaging & 3D structures
- Soldering & Chip attachment
- Simulation & Testing
- Sensors & Nanostructures
Keynotes
- CEITEC BUT
- Koenen GmbH
- Sanmina
- PBT Works
Specialized workshops
WIREBONDING of SEMICONDUCTOR CHIPS
CEITEC open day (visit CEITEC building and see equipment of Core Facility)
For exhibitors
The congress will be held in the beautiful town of Brno in the South Moravia Region. The exhibition will be located mostly in the foyer of the presentation rooms in building of Brno University of Technology. There is no better way for exhibitors to be integrated in the conference programme throughout the meeting.
We provide exhibitors with:
- Variety of different exhibition spaces
- Exhibiton tables
- Exhibitor registrations
- Ancillary services and many more
General chairman: prof. Ing. Radimír Vrba, CSc. Director of CEITEC BUT
Co-chairman: doc. Ing. Jiří Háze, Ph.D. Head of Department of Microelectronics
More information (fees, etc.): http://czech.imapseurope.org/
Contact: ifc@imaps.cz
