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Atomic layer deposition system Ultratech/CambridgeNanoTech Fiji 200

Name:	Atomic layer deposition system Ultratech/CambridgeNanoTech Fiji 200
Instrument:	Ultratech-Cambridge Nanotech Fiji 200
Technology / Methodology:	Etching & Deposition
Location:	CEITEC Vysoké učení technické v Brně
Instrument description:	Atomic Layer Deposition is a deposition technique for very thin layers with the thickness control down to a single atomic layer. It belongs to the CVD techniques family. The thickness precision is achieved by pulsed deposition, where first a metal-containing precursor is introduced into the chamber and after a short time (allowing for a monolayer adsorption) the chamber is pumped down. Following step is an exposure to the oxidizing precursor (for oxides) or nitrogen containing precursor (for nitrides). Thus, a monolayer of target material is grown. The metal-containing precursors are usually organometallic ones, for oxidation a water or oxygen plasma can be used, nitridation is done using water or nitrogen plasma. To achieve the deposition in the ALD mode, sample is heated up to a certain temperature, for most processes being in the range from 150 to 300 °C.
More information / Supplier:	http://cfnanomicro.fme.vutbr.cz/instrument.php?id=7
Research group:	CF: CEITEC Nano
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